Advanced plasma facility

PVD + PECVD used for fabrication of multi-layer thin films & nanostructuring of material, surface treatment

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Post author: Jane Dai. Last update: 03/02/2016 at 3:10 pm by Jane Dai.

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Overview

Dr. Jane Dai

Phone: +61 3 522 72427

Details

Overview

This custom-designed facility combines physical vapour deposition with plasma enhanced chemical vapour deposition in a dual chamber system. In the PVD chamber, a Torus Magnetron sputter source and the substrate rotation feed-through provide the best film uniformity. It also has a high strength magnet assembly for sputtering magnetic materials. The PECVD also includes a substrate heater that allows samples to be heated to 800°C and DC/RF biasing to control the direction of nanomaterial growth. The samples can be horizontally transferred from one chamber to the other via a power probe (without exposure to air). Its multi-functional capabilities enable the dry fabrication of nanostructures (both top-down and bottom-up), their surface treatment, and multi-layer thin films & nanostructuring of materials in one instrument.

Benefits of the Advanced plasma facility

Its multi-functional capabilities enable the dry fabrication of nanostructures (both top-down and bottom-up), their surface treatment, and multi-layer thin films & nanostructuring of materials in one instrument.

Technical features and specifications

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Tags

Capacity: We encourage greater utilisation
Operation: Facility staff operate this instrument, User operated training provided, User or facility staff operate, User or facility staff operate pricing may vary
Access: Access pricing may vary, External researcher use available